TONG HSING ELECTRONIC INDUSTRIES, LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 9353
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 2196
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 191
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0083,736 FINGERPRINT SENSING DEVICE AND METHOD FOR PRODUCING THE SAMESep 14, 16Mar 23, 17[H01L, G06K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9892302 Fingerprint sensing device and method for producing the sameSep 02, 16Feb 13, 18[H01L, G06K]
9801288 Multilayer circuit board and method for manufacturing the sameApr 30, 15Oct 24, 17[H05K]
9468091 Stress-reduced circuit board and method for forming the sameAug 07, 13Oct 11, 16[H05K]
9125335 Ceramic circuit board and method of making the sameApr 12, 13Sep 01, 15[H01L, H05K]
8898892 Method of making circuit board moduleSep 05, 13Dec 02, 14[H01L, H05K]
8549739 Method of making circuit board moduleMay 13, 10Oct 08, 13[H05K]
8461614 Packaging substrate device, method for making the packaging substrate device, and packaged light emitting deviceApr 02, 10Jun 11, 13[H01L]
7811861 Image sensing device and packaging method thereofAug 01, 08Oct 12, 10[H01L]
7776640 Image sensing device and packaging method thereofSep 26, 08Aug 17, 10[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0247,696 INTERPOSER AND METHOD FOR PRODUCING THE SAMEAbandonedMay 02, 16Aug 25, 16[C25D, H01L]
2015/0292,099 INTERPOSER AND METHOD FOR PRODUCING THE SAMEAbandonedApr 07, 15Oct 15, 15[C25D, H01L, H05K]
2014/0090,825 LIQUID-COOLED HEAT DISSIPATING DEVICE AND METHOD OF MAKING THE SAMEAbandonedNov 12, 13Apr 03, 14[F28F]
2013/0155,629 Hermetic Semiconductor Package Structure and Method for Manufacturing the sameAbandonedMay 10, 12Jun 20, 13[H05K]
2013/0153,016 Solar Cell Flip Chip Package Structure and Method for Manufacturing the sameAbandonedDec 20, 11Jun 20, 13[H01L]
2013/0127,004 Image Sensor Module Package and Manufacturing Method ThereofAbandonedJun 01, 12May 23, 13[H01L]
2012/0171,510 CERAMIC PLATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING THE SAMEAbandonedApr 12, 11Jul 05, 12[C23C, C25D, B05D, B32B]
2011/0057,216 Low profile optoelectronic device packageAbandonedSep 10, 09Mar 10, 11[H01L]
2010/0307,730 Liquid-cooled heat dissipating device and method of making the sameAbandonedJun 01, 10Dec 09, 10[F28F, B21D]
2010/0288,536 Ceramic circuit board and method of making the sameAbandonedMay 11, 10Nov 18, 10[B29C, H05K, B32B]
2010/0025,793 Assembly for image sensing chip and assembling method thereofAbandonedAug 01, 08Feb 04, 10[H01J, H01L, H05K]
2009/0152,237 Ceramic-Copper Foil Bonding MethodAbandonedDec 16, 08Jun 18, 09[C23F, B32B]
2008/0308,889 Image sensing module and method for packaging the sameAbandonedMay 15, 08Dec 18, 08[H01L]
7388192 Image sensing module and process for packaging the sameExpiredJul 11, 06Jun 17, 08[H01J]
5045639 Pin grid array packageExpiredAug 21, 90Sep 03, 91[H01L]

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